SC-CH

Introduction

H.SAC ceramic material has the characteristics of good insulation, high thermal conductivity, high infrared radiation rate and low expansion coefficient. It can become a new material for heat dissipation of LED lighting and network communication products.

H.SAC can withstand large current, high voltage, leakage breakdown, no noise, and will not produce coupling parasitic capacitance with MOS and other power tubes, thus simplifying the filtering process; the required creepage distance is shorter than that required by the financial body, which further saves board space and is more conducive to engineers’ design and electrical certification; H.SAC has multi-directional heat dissipation and is suitable for IC packaging with multi-directional heat dissipation;

H.SAC material is small in size, light in weight, does not occupy space, and is more conducive to the reasonable layout of product design;

H.SAC has good heat dissipation and heat transfer performance, which can effectively solve the heat dissipation problem of electronic products and power components and extend the service life of products.

Property

As a green and environmentally friendly material, the product is mainly used in LED lighting and related electronic industries. H.SAC ceramic products can effectively solve the thermal conductivity and heat dissipation problems in the electronics and optoelectronics industries, and provide technical support and breakthroughs for the innovation and development of electronic products.

Application

• Components: ICs, chipsets, CPU, MOS, SouthBridge
• LED: General (commercial) lighting heat sink
• TV: Thin LCD TV/Set-top box
• Network equipment: AP, Route, ADSL, Modern, S/W
• Information technology:M/B, NB, Video, Card
• Memory: DDR3-DIMM, SO-DIMM, SSD
• Power supply: Power module, Power transistor

Size

Product size: Various shapes