SC-TCF

Introduction

SC-TCF is a new lightweight, high-strength directional thermal pad with ultra-high thermal conductivity and ultra-low thermal resistance. By using an advanced arrangement technology, the thermal conductive filling material is evenly and vertically distributed in the matrix of high thermal conductivity molecules, which can greatly improve the heat transfer efficiency. At the same time, the low filling ratio makes the material have good mechanical properties and excellent thermal stability, and is widely used in the electronic field with high requirements for heat dissipation. This high thermal conductive filling itself is fibrous and can be designed with thermal orientation, which is the biggest difference and advantage from previous thermal conductive materials.

Property

• Thermal conductivity 20~35 W/m·k
• Ultra-low thermal impedance, low filling ratio, lightweight
• Zero oil seepage, excellent reliability
• Safe and environmentally friendly, RoHS compatible
• Corrosion resistant, anti-oxidation

Application

• Satellites, radars
• Large servers
• Data processing centers
• Signal converters
• Mass storage devices
• High-power devices
• Electronic communication equipment