SC-TIS

Introduction

TIS is a two-component, high thermal conductivity, room temperature curable, long working time, fire retardant silicone potting compound. It is particularly suitable for potting capacitors and small electronic devices. Its flexibility and elasticity enable it to provide a buffer for the coated material. The lower viscosity allows the thermally conductive potting compound to more fully cover the surface during the period, greatly improving the efficiency of heat conduction from the heating device or the entire PCB to the metal housing or diffusion plate, thereby improving the efficiency and service life of electronic components.

Property

• Good insulation
• Low viscosity, conducive to gas discharge
• Good solvent resistance and waterproof performance
• Excellent high and low temperature resistance

Application

• Power supply, connector, sensor, industrial control, transformer, coil, amplifier, high voltage package, relay, high current junction box, etc.
• Assembly of heat sink, potting of thermal sensor, potting of thermal conductive products
• Heat conduction between battery cell and cooling tube
• LED and power driver potting